J-System 33 - Low Slump Levelling Compound

Product Description

Main Application Field
• Patching, repair and filling of holes for most substrates in need for all renovation prior to levelling and installation works
.• Creating absorbent substrates with high strength that are quickly ready for covering
.• Forming falls and coves etc. (A suitable covering/coating is required if used as a wearing surface)
• For thicknesses 1-80 mm

Product Features & Benefits
• Rapid setting and drying to give exceptional strength and hardness
• Slump free
• Is re-stirable during the working time so the application time can be extended
• For thicknessess from 1-80mm

Full (BPIR) PRODUCT DECLARATION available to download from the Jacobsen website.